Technology Type |
Digital Light Processing (DLP) |
Electrical Requirements |
200-240 VAC, 50/60 Hz |
Build Envelope Capacity |
192 × 108 × 200 mm |
File Format for Processing |
.stl,.obj,.off,.ply |
Pixel Size |
50 μm |
File Format for Printer |
UTK |
Resolution |
3840 x 2160 Pixel |
Rated Power |
800 W |
Wavelength |
405 nm |
Systems Control |
Closed-loop |
Light Source |
UV LED |
Temperature Range |
72–79 °F (22–26 °C) |
Projection Method |
Bottom-up projection |
Maximum Change Rate |
1 °C/hour |
Layer Thickness |
30/50µ |
Relative Humidity |
< 40% non-condensing |
Controlling Software |
UnionTech™ DSCON |
Machine Size (W x D x H) |
600 × 510 × 1450 mm |
Data Preparation Software |
Polydevs, BPC |
Machine Weight |
122 kg |
Data Transmission |
Ethernet / USB |
Processing and Finishing |
Post-Curing Unit (optional) |